Key points
- The leaked specification lists a Snapdragon 7s Gen 2 processor, 8 or 12 GB of RAM and 256 GB of storage.
- The 6.56-inch IPS display is expected to upgrade from HD+ at 90 Hz to Full HD+ at 120 Hz.
- A 108 MP main camera may gain optical stabilization, alongside a 2 MP auxiliary module and 50 MP selfie camera; four years of updates are also mentioned.
Context
HMD introduced the original Fusion in September 2024, highlighting its modular design and rear Smart Pin contacts for accessories such as wireless charging and a ring light. HMD also provides an open-source toolkit for developing and 3D-printing compatible cases, although the refreshed model remains an unconfirmed consumer product rather than an enterprise technology.
What this means for you
Directly applicable
Developers can use the existing open-source toolkit to design and 3D-print cases for Smart Pin accessories, but the phone itself has limited architectural relevance.
Who benefits: Developers prototyping modular phone accessories can use the open-source case toolkit; enterprise architects and technical decision-makers have little immediate need to act.